These are papers sent in by site viewers. I will check with John Barnes if they are in the library. They have been placed here as a discussion book mark for the blogs and to enable easy viewing for debate. Many papers received, will be putting up over the next few days apologies for the delay

John 

New links to papers as at 10/10/06

RoHS will lead to tin whiskers – iNEMI

 

AeA translation of final China RoHS

 

Thanks to Werner for these papers

Engelmaier, W., “Lead-Free (LF) Wave-Soldering: Can (Should) It Be Eliminated,” Global SMT & Packaging, Vol. 5, No. 9, October 2005, pp. 46-50.
Engelmaier, W., “Printed Circuit Board Reliability: Needed PCB Design Changes for Lead-Free Soldering,” Global SMT & Packaging, Vol. 5, No. 8, September 2005, pp. 41-44.
Engelmaier, W., “Reliability of Lead-Free (LF) Solder Joints Revisited,” Global SMT & Packaging, Vol. 3, No. 7, October 2003, pp. 26-27.
Engelmaier, W., “Reliability of Lead-Free (LF) Solder Joints,” Global SMT & Packaging, Vol. 3, No. 3, April 2003, pp. 36-38.

Thanks to Bev and the team at RIM for these papers:

Leaching of Lead and Other Elements from Portable Electronics - B. Christian, David Turner and Alexandre Romanov Research In Motion Waterloo , Ontario, CANADA
Leaching of Lead and Other Elements from Portable Electronics, Part II Bev Christian and Alexandre Romanov Research In Motion Waterloo, Ontario, CANADA

Thanks to Patrick  at Interflux USA for this USAF advisory on lead free:

SUBJECT: Airworthiness Advisory AA-05-01, Lead-Free Solder DEPARTMENT OF THE AIR FORCE AA-05-01 Headquarters Aeronautical Systems Center (AFMC) 9 May 2005 Engineering Directorate